1/6 EMIF10-LCD01F1 ? november 2003 - ed: 2a iec61000-4-2 level 4 input pins 15kv (air discharge) 8 kv (contact discharge) level 1 output pins 2kv (air discharge) 2kv (contact discharge) mil std 883e - method 3015-6 class 3 complies with the following standards: flip chip package a b c d e 1 2 3 4 5 o10 o8 o6 o4 o2 o9 o7 o5 o3 o1 i10 i8 i6 i4 i2 i9 gnd gnd gnd i5 i1 i7 gnd gnd i3 pin configuration (ball side) n emi symmetrical (i/o) low-pass filter n high efficiency in emi filtering n very low pcb space consuming: 2.64mm x 2.64mm n very thin package: 0.65 mm n high efficiency in esd suppression on input pins (iec6100-4-2 level 4) n high reliability offered by monolithic integration n high reducing of parasitic elements through in- tegration & wafer level packaging. benefits 10 lines emi filter and esd protection ipad tm where emi filtering in esd sensitive equipment is required : n lcd for mobile phones n computers and printers n communication systems n mcu boards main product characteristics: the EMIF10-LCD01F1 is a 10 lines highly integrated devices designed to suppress emi/rfi noise in all systems subjected to electromagnetic interferences. the emif10 flip chip packaging means the package size is equal to the die size. this filter includes an esd protection circuitry, which prevents the device from destruction when subjected to esd surges up 15kv. description tm : ipad is a trademark of stmicroelectronics. input gnd gnd gnd output low-pass filter ri/o = 100 cline = 35pf w basic cell configuration
EMIF10-LCD01F1 2/6 i v i f i rm i r i pp v rm v f v br v cl fig. 1: s21(db) all lines attenuation measurement and aplac simulation. fig. 2: analog crosstalk measurements. symbol parameter and test conditions value unit t j maximum junction temperature 125 c t op operating temperature range -40 to + 85 c t stg storage temperature range -55 to +150 c absolute maximum ratings (t amb =25c) symbol parameters v br breakdown voltage i rm leakage current @ v rm v rm stand-off voltage v cl clamping voltage r d dynamic impedance i pp peak pulse current r i/o series resistance between input & output c line input capacitance per line electrical characteristics (t amb = 25c) symbol test conditions min typ max unit v br i r = 1ma 6 8 10 v i rm v rm =3v 500 na r i/o 90 100 110 w c line at 0v bias 35 pf rt/ft induced rise and fall time 10-90% at 26 mhz fre- quency signa l v = 1.9 v (rt / ft input 1 ns, 50 w impedance generator) 8 (1) ns (1) guaranteed by design
EMIF10-LCD01F1 3/6 v in v out fig. 3: esd response to iec61000-4-2 (+15kv air discharge) on one input and one output. fig. 6: rise time 10-90% measurements with 1.9v signal at 26 mhz frequency (50 w generator). 0 5 10 15 20 25 30 35 0.0 1.0 2.0 3.0 4.0 5.0 vline(v) cline(pf) fig. 5: line capacitance versus applied voltage. fig. 7: fall time 10-90% measurements with 1.9v signal at 26 mhz frequency (50 w generator). fig. 4: esd response to iec61000-4-2 (-15kv air discharge) on one input and one output.
EMIF10-LCD01F1 4/6 EMIF10-LCD01F1 model ground return aplac model. zrz structure aplacvar remif10low 100 aplacvar cemif10flow 17.5pf bumps aplacvar lbump 50ph aplacvar rbump 20m aplacvar cbump 1.5pf bulk aplacvar rsub 100m gnd connections aplacvar rgnd 100m aplacvar lgnd 200ph aplacvar cgnd 0.15pf bv = 7 cjo = cemif10low ibv = 1u ikf = 1000 is = 10f isr = 100p n = 1 m = 0.3333 rs = 0.015 vj = 0.6 tt = 50n aplac parameters. emif yy f x - xxx zz emi filter number of lines x: resistance value (ohms) z: capacitance value / 10(pf) or application (3 letters) and version (2 digits) flip chip 1: pitch = 500m bump = 315m 2: leadfree pitch = 500m bump = 315m 3: leadfree pitch = 400m bump = 250m 4: pitch = 500m bump = 250m order code
EMIF10-LCD01F1 5/6 250m 40 650m 65 2.64mm 50m 2.64mm 50m 315m 50 500m 50 500m 50 package mechanical data flip chip 545 545 400 100 230 x y x w x w dot, st logo xxx = marking yww = datecode (y = year ww = week) all dimensions in m marking copper pad diameter : 250m recommended , 300m max solder stencil opening : 330m solder mask opening recommendation : 340m min for 315m copper pad diameter foot print recommendations
EMIF10-LCD01F1 6/6 information furnished is believed to be accurate and reliable. however, stmicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. no license is granted by implication or otherwise under any patent or patent rights of stmicroelectronics. specifications mentioned in this publication are subject to change without notice. this publication supersedes and replaces all information previously supplied. stmicroelectronics products are not au- thorized for use as critical components in life support devices or systems without express written approval of stmicroelectronics. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2003 stmicroelectronics - all rights reserved. stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - italy - japan - malaysia - malta - morocco - singapore - spain - sweden - switzerland - united kingdom - united states www.st.com dot identifying pin a1 location user direction of unreeling all dimensions in mm 4 +/- 0.1 8 +/- 0.3 4 +/- 0.1 1.75 +/- 0.1 3.5 +/- 0.1 ? 1.5 +/- 0.1 0.73 +/- 0.05 st xxx yww st xxx yww st xxx yww packing ordering code marking package weight base qty delivery mode EMIF10-LCD01F1 flt flip chip 9.3 mg 5000 tape & reel (7) other information note: more information are available in the application notes: - an1235: ''flip-chip: package description and recommandations for use'' - an1751: "emi filters: recommendations and measurements"
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